The SAMCO PD-220N is a unique new Plasma-Enhanced Chemical Vapor Deposition (PECVD) system designed to deposit silicon films (SiO2, Si3N4, SiOxNy, a-Si:H). The system offers all of the standard features for PECVD in a very compact footprint. Films with superior thickness and refractive index uniformity can be deposited over a 220 mm diameter area, with excellent batch-to-batch repeatability. A computerized touch panel provides a user-friendly interface for parameter control and recipe storage. The system is ideal for depositing thin films for research and development, and pilot production.
